creat by art - low power loss, high efficiency - guardring for overvoltage protection - high surge current capability - halogen-free according to iec 61249-2-21 definition molding compound, ul flammability classification rating 94v-0 base p/n with suffix "g" on packing code - halogen-free base p/n with prefix "h" on packing code - aec-q101 qualified terminal: matte tin plated leads, solderable per jesd22-b102 meet jesd 201 class 1a whisker test, with prefix "h" on packing code meet jesd 201 class 2 whisker test v rrm 20 30 40 50 60 90 100 150 v v rms 14 21 28 35 42 63 70 105 v v dc 20 30 40 50 60 90 100 150 v i f(av) a dv/dt v/ s r jc o c/w t j o c t stg o c document number: ds_d1308041 version: i13 SR2020 thru sr20150 taiwan semiconductor dual common cathode schottk y rectifier features - compliant to rohs directive 2011/65/eu and in accordance to weee 2002/96/ec to-220ab mechanical data case: to-220ab polarity: as marked mounting torque: 5 in-lbs maximum weight: 1.8 g (approximately) maximum ratings and electrical characteristics (t a =25 unless otherwise noted) parameter symbol sr 2020 sr 2030 sr 2040 sr 2050 sr 2060 maximum average forward rectified current 20 sr 2090 sr 20150 unit maximum repetitive peak reverse voltage maximum rms voltage maximum dc blocking voltage maximum instantaneous forward voltage (note 1) i f =10a v f v peak forward surge current, 8.3 ms single half sine-wave superimposed on rated load i fsm 200 a ma voltage rate of change (rated v r ) 10000 10 - -5.0 maximum reverse current @ rated vr t j =25 t j =100 t j =125 i r typical thermal resistance operating junction temperature range storage temperature range - 55 to +150 1.0 - 55 to +125 - 55 to +150 note 1: pulse test with pw=300 s, 1% duty cycle sr 20100 0.55 0.70 0.90 1.00 0.5 0.1 15
part no. sr20xx part no. sr2060 sr2060 sr2060 (ta=25 unless otherwise noted) document number: ds_d1308041 version: i13 SR2020 thru sr20150 taiwan semiconductor ordering information aec-q101 qualified packing code green compound code package packing prefix "h" c0 suffix "g" to-220ab 50 / tube note 1: "xx" defines voltage from 20v (SR2020) to 150v (sr20150) example preferred p/n aec-q101 qualified packing code green compound code description sr2060 c0 c0 sr2060 c0g c0 g green compound sr2060hc0 h c0 aec-q101 qualified ratings and characteristics curves 0 5 10 15 20 25 50 100 150 average forward current (a) case temperature ( o c) fig. 1- forward current derating curve sr2050-150 SR2020-40 resistive of inductive load with heatsink 0 50 100 150 200 250 300 1 10 100 peak forward surge current (a) number of cycles at 60 hz fig. 2- maximum non-repetitive peak forward surge current per leg 8.3ms single helf sine wave per leg. (jedec method) 0.001 0.01 0.1 1 10 0 20 40 60 80 100 120 140 instantaneous reverse current (ma) percent of rated peak reverse voltage (%) fig. 4- typical reverse characteristics per leg tj=25 tj=100 0.1 1 10 100 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 instantaneous forward current (a) instantaneous forward voltage (v) fig. 3- typical forward characteristics per leg sr2050-2060 SR2020-2040 sr2090-20100 pulse width-300 s 1% duty cycle sr20150
min max min max a - 10.50 - 0.413 b 2.62 3.44 0.103 0.135 c 2.80 4.20 0.110 0.165 d 0.68 0.94 0.027 0.037 e 3.54 4.00 0.139 0.157 f 14.60 16.00 0.575 0.630 g 13.19 14.79 0.519 0.582 h 2.41 2.67 0.095 0.105 i 4.42 4.76 0.174 0.187 j 1.14 1.40 0.045 0.055 k 5.84 6.86 0.230 0.270 l 2.20 2.80 0.087 0.110 m 0.35 0.64 0.014 0.025 p/n = marking code g = green compound yww = date code f = factory code document number: ds_d1308041 version: i13 marking diagram SR2020 thru sr20150 taiwan semiconductor package outline dimensions dim. unit (mm) unit (inch) 100 1000 10000 0.1 1 10 100 junction capacitance (pf) a reverse voltage (v) fig. 5- typical junction capacitance per leg f=1.0mhz vsig=50mvp-p sr2050-150 SR2020-40 0.1 1 10 100 0.01 0.1 1 10 100 transient thermal impedance ( /w) t, pulse duration. (sec) fig. 6- typical transient thermal impedance per leg
creat by art assumes no responsibility or liability for any errors inaccuracies. information contained herein is intended to provide a product description only. no license, express or implied,to any intellectual property rights is granted by this document. except as provided in tsc's terms and conditions of sale for such products, tsc assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of tsc products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. the products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. customers using or seling these products for use in such applications do so at their own risk and agree to fully indemnify tsc for any damages resulting from such improper use or sale. document number: ds_d1308041 version: i13 SR2020 thru sr20150 taiwan semiconductor notice specifications of the products displayed herein are subject to change without notice. tsc or anyone on its behalf,
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